SUNSHINE
SUNSHINE SS-T12B 13 In 1 Mobile Phone Motherboard Smart Repair Heating Platform Kit Support IP7G-16PM/Android Universal
SUNSHINE SS-T12B 13 In 1 Mobile Phone Motherboard Smart Repair Heating Platform Kit Support IP7G-16PM/Android Universal
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Get It Now, Pay Later
Get It Now, Pay Later
Pay using Mobicred. Simply choose Peach Payment >> Mobicred at checkout, and we’ll ship it once the order is approved.
FREE Shipping
FREE Shipping
FREE SHIPPING at checkout. Ships via Buffalo Logistics. Fully insured.
Handling time: 1 - 3 working days. (PMC has to process your order and put all your items through its strict quality-control tests.)
Transit time: 5 - 10 working days.
Overseas Warehouse: Shipping from China.
Duties and Taxes
- For orders up to and including R2000 - No Additional Charges: The price you see is the final price—no hidden costs or extra taxes.
- For all orders over R2000, we are unable to offer DDP (Delivered Duty Paid), and you will be responsible for any import duties, taxes, and customs clearance fees.
Return Guarantee
Return Guarantee
For whatever reason, if you are unsatisfied with your order within 7 days, you can return it to us in new condition.
Payment & Security
Payment & Security
Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.
Missing/Wrong Items Guarantee
Missing/Wrong Items Guarantee
If you receive a parcel with missing/incorrect/secondary packing items, please contact us within 7 days of delivery and provide the relevant proof. PMC will make compensation based on the damage situation.
1. Operating voltage: AC220V/50Hz (AC110V can be customized)
2. Temperature range: 80-250°C
3. Net weight: 13 in 1 about 1000g, 9 in 1 about 915g
4. Size: host about 13.5 x 13 x 2.8cm, heating area about 5.2 x 9.5cm
5. Packing list: 13 in 1: host x 1/module x 12/instruction manual x 1/power cable x 1, 9 in 1: host x 1/module x 8/instruction manual x 1/power cable x 1
Functional features:
1. Large heating area, good compatibility, support a variety of motherboard components desoldering operation, more convenient and fast
2. Modular design, a variety of combinations of modules, base universal module, scalability, easy to expand the new module
3. Intelligent temperature control, customized according to different melting point debugging temperature, with fast heating, long life, temperature uniformity
4. 360-degree rotating snap rail design, suitable for different shapes of the motherboard precision clamping, improve maintenance efficiency
5. Accurate positioning module, set up with positioning columns, can be accurately separated and fit the motherboard, easy to pick up, heat dissipation and non-slip
6. No air gun and no soldering iron, support IP7G-16PM/Android series of various sizes of cell phone motherboard layering/tinning/laminating/desoldering
7. Real machine testing to ensure accuracy, suitable for IP16/16Plus/16Pro/16Pro Max, to meet your maintenance needs
